Introduction of PCB layout using Altium

This course focuses on advanced PCB layout techniques using Altium Designer, guiding participants through complex multi-layer designs, signal integrity optimization, and high-speed circuit considerations. Attendees will gain expertise in managing large projects, working with design constraints, and using 3D tools to validate mechanical fit. The course emphasizes best practices for designing high-performance and manufacturable PCBs, ensuring compliance with industry standards.

Prerequisites

• Intermediate Knowledge of Altium Designer (basic PCB layout and schematic capture)
• Understanding of Electronics and Circuits
• Experience with Multi-layer PCB Design (preferred)

Table of Contents

1: Multi-Layer PCB Design and Layer Stack Management

1.1 Overview of Multi-Layer PCB Design Principles
1.2 Configuring Layer Stack Manager (Signal, Power, and Ground Layers)
1.3 Defining Impedance-Controlled Layers
1.4 Using Blind, Buried, and Through Vias

2: Advanced Routing Techniques

2.1 Differential Pair Routing for High-Speed Signals
2.2 Length Matching and Delay Tuning(Ref: Mastering Altium: Design Rule Checking (DRC))
2.3 Via Stitching and Via Shielding Techniques
2.4 Using the Interactive Router for Advanced Layout

3: Signal Integrity and Power Integrity

3.1 Signal Integrity Challenges in High-Speed Design
3.2 Power Plane Optimization and Decoupling Strategies
3.3 Configuring and Analyzing Signal Integrity Simulations
3.4 Reducing Noise and Crosstalk in Layouts

4: 3D PCB Design and Mechanical Integration

4.1 Visualizing and Editing the PCB in 3D Mode
4.2 Integrating PCB with Mechanical Enclosures (STEP Export)
4.3 Using Altium’s Collision Detection Tools
4.4 Designing for Thermal Management and Heat Dissipation

5: Design Constraints and Rules Management

5.1 Setting Up Advanced Design Rules and Constraints
5.2 Electrical, Clearance, and Mechanical Constraints
5.3 Creating Custom Rules for High-Density Designs
5.4 Running Design Rule Checks (DRC) for Error-Free Layouts

6: High-Density Interconnect (HDI) Design

6.1 Overview of HDI Technology: Microvias and Sequential Lamination
6.2 Designing HDI Boards with Embedded Components
6.3 Challenges and Solutions for High-Density Routing
6.4 Preparing HDI Designs for Manufacturing

7: Collaboration and Version Control

7.1 Working with Altium 365 for Cloud Collaboration
7.2 Using Version Control for Large PCB Projects
7.3 Sharing and Reviewing Design Data with Stakeholders
7.4 Managing Component Libraries in Collaborative Environments

8: Preparing for Manufacturing and Assembly

8.1 Generating Gerber Files, NC Drill Files, and Assembly Drawings
8.2 Creating Pick-and-Place Files for Automated Assembly
8.3 Ensuring Design for Manufacturing (DFM) Compliance
8.4 Reviewing Case Studies of Manufacturing Challenges

9: Final Project and Review

9.1 Designing a Complex Multi-Layer PCB from Start to Finish
9.2 Applying Advanced Routing, 3D Validation, and DRC Techniques
9.3 Project Presentation and Peer Feedback
9.4 Q&A and Course Wrap-Up

Conclusion

This course empowers participants to design complex, high-performance PCBs using advanced layout techniques in Altium Designer. By mastering multi-layer design, signal integrity, HDI principles, and DFM compliance, participants will be ready to tackle cutting-edge projects and bring their designs seamlessly from concept to manufacturing.

Reference