Description

Introduction

The training on Parasitic Extraction & Post-Layout Simulation in Custom Compiler is based on the advanced custom IC design platform Synopsys Custom Compiler. It provides an integrated environment for schematic design, layout implementation, parasitic extraction, and post-layout verification. The platform enables accurate modeling of interconnect effects and supports advanced node technologies used in analog, mixed-signal, RF, and custom digital IC design. This training focuses on improving design accuracy by analyzing real-world parasitic impacts through simulation-driven verification.

Learner Prerequisites

• Basic understanding of VLSI design flow and CMOS fundamentals
• Knowledge of schematic capture and circuit simulation concepts
• Familiarity with layout design, routing, and physical verification basics
• Understanding of SPICE simulation and device modeling concepts
• Awareness of DRC, LVS, and physical design signoff flow
• Basic knowledge of RC effects, parasitics, and signal integrity concepts
• Familiarity with EDA tools used in custom IC design environments

Table of Contents

1. Overview of Parasitic Extraction & Post-Layout Simulation
1.1 Role of parasitic extraction in full IC design flow
1.2 Difference between schematic-level and post-layout simulation
1.3 Importance in nanometer-scale and deep submicron technologies
1.4 Impact of parasitics on performance, power, and timing
1.5 Real-world application in analog, RF, and digital designs

2. Layout Preparation for Parasitic Extraction
2.1 Ensuring DRC-clean and LVS-clean layout before extraction
2.2 Importance of correct net connectivity and labeling
2.3 Layer mapping accuracy for reliable extraction results
2.4 Reducing layout errors that affect parasitic accuracy
2.5 Pre-extraction checks like shorts, opens, and antenna issues

3. Fundamentals of Parasitic Extraction (PEX)
3.1 Extraction of parasitic resistance in interconnects
3.2 Capacitance modeling including ground and coupling effects
3.3 Substrate coupling and its impact on circuit behavior
3.4 Importance of distributed RC networks in modern nodes
3.5 Accuracy trade-offs between speed and precision in extraction

4. Extraction Flows and Methodologies
4.1 Rule-based extraction techniques and their use cases
4.2 Field-solver based extraction for high accuracy requirements
4.3 Standard industry extraction flow steps
4.4 Tool-driven automation in parasitic extraction
4.5 Selection criteria for extraction methodology based on design type

5. Parasitic Netlist Generation & Back-Annotation
5.1 Generation of parasitic-aware netlists from layout data
5.2 Formats such as SPEF, DSPF, and their significance
5.3 Back-annotation into SPICE or simulation environments
5.4 Correlation between schematic netlist and extracted netlist
5.5 Handling mismatches during netlist comparison

6. Post-Layout Simulation Setup
6.1 Integration of extracted netlist with SPICE simulation
6.2 Creation of testbenches for real-world verification
6.3 Setting up voltage sources, loads, and stimulus conditions
6.4 Performing DC, AC, and transient analysis after layout
6.5 Including parasitic effects in simulation environment

7. Verification with Post-Layout Results
7.1 Comparison between pre-layout and post-layout results
7.2 Functional verification after parasitic inclusion
7.3 Timing verification including delay analysis
7.4 Power estimation differences due to parasitics
7.5 Identifying performance degradation sources

8. Debugging Parasitic-Related Issues
8.1 Identification of delay and timing violations
8.2 Analysis of crosstalk and coupling noise issues
8.3 Signal integrity degradation due to interconnect effects
8.4 Debugging layout-level parasitic hotspots
8.5 Iterative fixes using layout optimization techniques

9. Optimization Techniques in Post-Layout Design
9.1 Wire sizing to reduce resistance and delay
9.2 Buffer insertion for performance improvement
9.3 Shielding techniques to reduce coupling effects
9.4 Floorplanning improvements for shorter interconnects
9.5 Routing optimization for reduced parasitic impact

10. Signoff Flow and Tapeout Readiness
10.1 Final parasitic signoff verification steps
10.2 Correlation with timing, power, and reliability analysis
10.3 Ensuring compliance with design constraints
10.4 Final checks for manufacturability and yield
10.5 Criteria for tapeout approval in advanced nodes

Conclusion
Parasitic Extraction & Post-Layout Simulation is essential for achieving silicon-accurate circuit performance. It ensures that real-world interconnect effects are properly modeled and validated before fabrication. Mastering this flow helps engineers improve timing closure, reduce design failures, and achieve reliable tapeout results in advanced semiconductor technologies