Description

Introduction
Synopsys 3DIC Compiler is an advanced platform for 3D IC design planning. It is used for multi-die architecture setup, chiplet integration, and interposer-based design. Moreover, it supports system-level analysis and optimization. In addition, it helps improve performance, power, and area efficiency. Therefore, it is widely used in modern heterogeneous integration flows.

Learner Prerequisites

• Basic knowledge of VLSI design flow and semiconductor fundamentals
• Furthermore, understanding of physical design concepts like floorplanning and placement
• In addition, familiarity with chip packaging concepts such as interposers and chiplets
• Moreover, awareness of multi-die architecture concepts
• Finally, basic experience with EDA tools and Linux environment

Table of Contents

1. Introduction to Multi-Die Architecture
1.1 Overview of chiplet-based and 3D IC systems
1.2 Evolution from monolithic SoC to multi-die integration
1.3 Benefits and challenges of heterogeneous architectures
1.4 Industry applications and use cases
1.5 Overview of multi-die design flow

2. 3DIC Compiler Platform Overview for Design Planning
2.1 Architecture of Synopsys 3DIC Compiler and its environment
2.2 Project setup and workspace configuration steps
2.3 Supported data models and file formats
2.4 Tool interfaces for architecture definition
2.5 Integration with floorplanning and analysis tools

3. System-Level Design Planning
3.1 Definition of system requirements and constraints
3.2 Partitioning strategies for multi-die design
3.3 Functional breakdown of chiplets
3.4 Power, performance, and area trade-offs
3.5 Early feasibility and risk analysis

4. Die-to-Die Connectivity Planning
4.1 Inter-die communication architecture design
4.2 Planning of TSVs, micro-bumps, and interconnects
4.3 Bandwidth and latency optimization techniques
4.4 Signal integrity considerations across dies
4.5 Routing strategies for stacked structures

5. Floorplanning for Multi-Die Systems
5.1 Die placement and stacking configurations
5.2 Interposer-based layout planning techniques
5.3 Floorplan constraints and optimization methods
5.4 Alignment of multiple dies in 2.5D/3D structures
5.5 Area utilization and density optimization

6. Power and Thermal Planning
6.1 Power distribution network design across dies
6.2 IR drop estimation and reduction methods
6.3 Thermal-aware planning techniques
6.4 Heat dissipation and hotspot control strategies
6.5 Power-performance-thermal optimization methods

7. Hierarchical Design Management
7.1 Hierarchy definition in multi-die systems
7.2 Block-level and die-level abstraction methods
7.3 IP reuse and modular design approaches
7.4 Cross-die dependency management techniques
7.5 Maintaining design consistency across hierarchy

8. Verification of Architecture Setup
8.1 Early architecture validation methods
8.2 Connectivity and interface correctness checks
8.3 Constraint validation and rule checking flow
8.4 Performance and scalability verification steps
8.5 Final readiness check for implementation

Conclusion
This training builds strong knowledge of multi-die architecture planning using Synopsys 3DIC Compiler. It improves understanding of system design, partitioning, and optimization for advanced 3D IC workflows.