Description

Introduction
Synopsys 3DIC Compiler is an advanced 3D IC design and analysis platform. It is widely used for multi-die integration, chiplet-based architectures, and heterogeneous system design. Moreover, it supports both 2.5D and 3D IC planning. This enables efficient floorplanning, interconnect modeling, power analysis, and thermal optimization. As a result, designers can improve performance, power efficiency, and packaging density in advanced semiconductor flows.

Learner Prerequisites

• Basic understanding of VLSI design flow and semiconductor fundamentals
• Knowledge of physical design concepts such as floorplanning, placement, and routing
• Familiarity with CMOS technology and IC fabrication processes
• Basic understanding of packaging concepts like interposers and chiplets
• Exposure to Linux environments and EDA tool workflows is beneficial

Table of Contents

1. Introduction to 3DIC Design Flow
1.1 Overview of 2.5D and 3D IC architectures and their applications
1.2 Evolution from monolithic SoC to chiplet-based systems
1.3 Benefits and limitations of multi-die integration
1.4 Key design challenges in advanced packaging technologies
1.5 Industry use cases and real-world adoption trends

2. 3DIC Compiler Platform Overview
2.1 Architecture of Synopsys 3DIC Compiler and unified design environment
2.2 Supported file formats, libraries, and integration flow
2.3 GUI workspace, design navigation, and visualization features
2.4 Command-line interface and scripting automation capabilities
2.5 Tool interoperability with signoff and verification tools

3. Design Planning and Floorplanning Fundamentals
3.1 Die stacking strategies and placement optimization techniques
3.2 Interposer-based design planning and routing considerations
3.3 Partitioning methodologies for multi-die architectures
3.4 Hierarchical design management in complex systems
3.5 Area, power, and performance trade-off analysis in floorplanning

4. Interconnect and Signal Modeling
4.1 Through-silicon vias (TSVs), micro-bumps, and inter-die connections
4.2 Signal integrity challenges in 3D stacked designs
4.3 Crosstalk, latency, and bandwidth considerations across dies
4.4 Timing closure across multi-die signal paths
4.5 Modeling parasitics in advanced packaging structures

5. Power Integrity and Thermal Analysis
5.1 Power delivery network design in multi-die systems
5.2 IR drop analysis and mitigation strategies
5.3 Thermal modeling and heat dissipation techniques
5.4 Hotspot detection and thermal-aware floorplanning
5.5 Power-performance-thermal (PPT) trade-off optimization

6. Packaging Technologies in 3DIC
6.1 Overview of 2.5D interposer-based integration techniques
6.2 True 3D stacking using TSV and hybrid bonding
6.3 Advanced packaging materials and constraints
6.4 Chiplet-based heterogeneous integration approaches
6.5 Cost, yield, and manufacturability considerations

7. Verification and Analysis Flow
7.1 Design rule checking (DRC) for 3D IC layouts
7.2 Cross-die LVS and connectivity validation techniques
7.3 Thermal and electrical signoff verification flows
7.4 Reliability analysis including aging and stress effects
7.5 Debugging and error correction methodologies

8. Implementation and Tapeout Preparation
8.1 Signoff checklist and design closure requirements
8.2 Data preparation for manufacturing and packaging
8.3 GDSII/OASIS generation and multi-die assembly
8.4 Final verification before tapeout release
8.5 Handoff procedures to foundry and packaging vendors

Conclusion
This training provides a strong foundation in 3DIC Compiler fundamentals. It covers multi-die design planning, implementation, and verification. In addition, it explains tapeout preparation for advanced semiconductor packaging. Therefore, learners can confidently work on modern 2.5D and 3D IC design projects.