This Multi-Layer PCBs using Altium course covers the fundamentals and advanced techniques. Participants will learn how to effectively create and manage multi-layer PCB layouts, addressing challenges such as signal integrity, power distribution, and thermal management. Through practical exercises and real-world examples, this training will enhance participants’ skills in designing complex, high-performance PCBs.

Prerequisites of Multi-Layer PCBs using Altium

• Basic Knowledge of PCB Design and Altium Designer
• Understanding of Electronic Components and Circuit Theory
• Familiarity with Schematic Capture and PCB Layout

Table of Contents

1: Introduction to Multi-Layer PCB Design

1.1 Understanding Multi-Layer PCB Structures
1.2 Advantages of Multi-Layer PCBs Over Single-Layer Designs
1.3 Overview of Altium’s Multi-Layer Design Features

2: Designing the Layer Stack

2.1 Configuring the Layer Stack in Altium(Ref: Managing Libraries in Altium Designer)
2.2 Understanding Layer Types: Signal, Power, Ground, etc.
2.3 Calculating Impedance and Managing Layer Thickness
2.4 Setting Up Layer Properties and Design Rules

3: Component Placement Strategies

3.1 Best Practices for Multi-Layer Component Placement
3.2 Managing Component Density and Layout Constraints
3.3 Implementing Design for Manufacturing (DFM) Considerations
3.4 Using Altium’s Tools for Efficient Placement

4: Routing Techniques for Multi-Layer Designs

4.1 Overview of Routing Strategies for Multi-Layer PCBs
4.2 Best Practices for High-Speed Signal Routing
4.3 Implementing Differential Pairs and Controlled Impedance
4.4 Utilizing Via Types for Effective Layer Transitions

5: Power and Ground Distribution

5.1 Designing Power Distribution Networks (PDN)
5.2 Implementing Ground Planes and Their Importance
5.3 Techniques for Reducing Noise and Ground Bounce
5.4 Managing Thermal Considerations in Multi-Layer Designs

6: Signal Integrity and EMI Considerations

6.1 Understanding Signal Integrity in Multi-Layer Designs
6.2 Identifying and Mitigating Electromagnetic Interference (EMI)
6.3 Using Altium’s Signal Integrity Tools
6.4 Conducting EMI Testing and Validation

7: Design Verification and DRC

7.1 Conducting Design Rule Checks (DRC) for Multi-Layer Designs
7.2 Using Altium’s Simulation Tools for Verification
7.3 Preparing for Manufacturing: Gerber Files and Assembly Drawings
7.4 Managing Changes and Revisions in Multi-Layer Designs

8: Final Project and Review

8.1 Conducting a Comprehensive Multi-Layer PCB Design Project in Altium
8.2 Presenting Design Decisions and Performance Metrics
8.3 Review of Key Multi-Layer Design Concepts and Techniques
8.4 Q&A and Course Wrap-Up

Conclusion

This training equips participants with the skills to effectively design Multi-Layer PCBs using Altium Designer. By mastering layer management, routing techniques, and signal integrity considerations, participants will enhance their ability to create complex, reliable, and high-performance PCB designs suitable for advanced applications.